SIA Online

International Technology Roadmap for Semiconductors Outlines Next 15 Years of Innovation

ckazmierski@sia-online.org (Caroline Kazmierski) — Tue, 07 Feb 2012 00:00:00 -0500

WASHINGTON, D.C.?FEBRUARY 7, 2012?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, announced that the 2011 International Technology Roadmap for Semiconductors (ITRS) has been publicly released. The comprehensive and detailed roadmap addresses near-term and long-term challenges and innovations for the semiconductor design and manufacturing industry through 2026. By identifying technical challenges well in advance the industry and research community can dedicate time and resources to overcoming them; ultimately enabling performance and capability increases for tomorrow?s semiconductors ? the fundamental building block of all technology used in modern society.

?The ITRS is an invaluable resource for mapping out the future of the technology industry. It offers a glimpse into future semiconductor advancements and the technical challenges that accompany the rapid pace of innovation that our industry is known for,? said Brian Toohey, president, Semiconductor Industry Association. ?The ITRS leverages our industry?s most brilliant researchers, engineers and scientists to address the highly complex interconnection of semiconductor design and manufacturing functions which will ultimately yield faster, smarter, more energy efficient, less costly and higher performance chips that will enable untold number of technology devices and functions in the future. The magnitude and implications of this type of globally coordinated effort are unmatched by any other industry and by working through some of the challenges and opportunities detailed in the ITRS, our industry will enable society to use technology to advance beyond our current level.?

The ITRS is sponsored by five regions of the world; Europe, Japan, Korea, Taiwan, and the United States and is overseen by SIA. The 2011 ITRS was presented at a public forum in Incheon, Korea on December 14, 2011. Through the cooperative efforts of the global chip manufacturers and equipment suppliers, research communities and consortia, the Roadmap teams identify critical challenges, technical needs and potential solutions. One of the primary challenges that the industry has identified is how to decrease the size of semiconductors while increasing performance standards to meet consumer demands.

?Since Intel co-founder, Gordon Moore identified the trend that chip performance doubles every two years, the industry has been working to meet and exceed this goal. The fact that our industry has been able to keep up this pace of innovation has brought about the proliferation of digital electronics and its significant impact on nearly every segment of the world economy,? continued Toohey. ?The ITRS is the industry?s plan to keep pace with Moore?s Law.?

Several key areas of advancement have been highlighted in the 2011 ITRS, specifically; memory, flash, and MEMS or micro-electro-mechanical systems. The ITRS report notes that Dynamic Random Access Memory (DRAM) technology development will be accelerated which will allow for faster introduction of technologies like higher-performance servers and sophisticated graphics for game consoles. Additionally, flash technology, used as memory in mobile computing devices such as digital cameras, tablet PCs and cell phones, is expected to experience accelerated development over the next two years. And the introduction of three-dimensional (3D) flash technology beginning in 2016 will allow for greater memory capabilities for a broad range of popular consumer electronics.

The 2011 ITRS also explores the newest possibilities for innovative interconnects, switches, devices, and materials to advance nanotechnology. While the continued scaling down to the nanometer level occurs, innovative designs and models for new applications and products have expanded research and development of micro-electro-mechanical systems or MEMS which is a type of sensor and are increasingly included in smartphones, tablets, digital cameras, and numerous other consumer electronic products. Researchers are also increasing attention in the RF and Analog Mixed-signal based technologies. Focus on such pioneering technologies in scaling and technology applications by the ITRS teams enable affordable, advanced products for consumers throughout the world.

In addition to addressing scale and performance challenges, the ITRS presents models for enhancing the highly complex manufacturing and measurement processes required to achieve smaller, higher performance and more energy efficient semiconductors. The ITRS also focuses on cost-effective manufacturing and resource conservation to meet the rapidly changing needs of semiconductor design innovations.

Each ITRS working group coordinates with related teams across disciplines to write reports indicating the state of the current technology, technology challenges, critical needs, potential solutions, and areas of innovation. When incorporated into the ITRS, the reports provide guidelines for the global industry that are intended for technology assessment only, without regard to any commercial considerations. Further, the roadmap can serve as a guide for corporate strategic plans and business unit programs; help to assess lead times for equipment development plans, process and materials; and assess key metrics for industry productivity/profitability such as progress on Moore?s law, productivity trends, industry cycles and economic models.

To learn more about the ITRS, visit www.itrs.net to download the Executive Summary, the Emerging Research Devices, MEMS, System Drivers, and other technology roadmap reports.

Semiconductor Industry Posts Record-Breaking Revenues Despite 2011 Challenges

ckazmierski@sia-online.org (Caroline Kazmierski) — Mon, 06 Feb 2012 00:00:00 -0500

WASHINGTON, D.C.?FEBRUARY 6, 2012?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that worldwide semiconductor sales for 2011 reached a record $299.5 billion, a year-on-year increase of 0.4 percent from the $298.3 billion recorded in 2010. Worldwide semiconductor sales in December amounted to $23.8 billion, a decrease of 5.5 percent from the month prior. Fourth quarter sales of $71.5 billion represent a 7.7 percent decline from the immediate prior quarter, and a 5.3 percent decrease over the same period in 2010. All monthly sales numbers represent a 3-month moving average.

?Between the natural disasters in Japan and Thailand and the overall impact of a weak global economy, 2011 presented a number of major challenges for the semiconductor industry. Despite these setbacks the industry showed resiliency and posted year on year growth with record-breaking revenues for 2011,? said Brian Toohey, president, Semiconductor Industry Association. ?The health of the industry is a direct reflection of the pervasiveness of semiconductor innovations and their applications in almost every aspect of modern society.?

In 2011 the industry saw strong demand in several areas; specifically the optoelectronic, sensor and actuator, and microprocessor markets showed solid year over year growth. Lamps and image sensors drove growth in the optoelectronic market to $23.1B, a 6.4% increase over 2010. Optoelectronic applications bring energy efficiency and low cost in a wide range of products including mobile devices and cameras.

Sensors and actuators, currently the smallest semiconductor market segment showed the highest year over year growth at 15.5% to $8.0B in 2011. Sensor technology which can be used to convert temperature, pressure or acceleration into electrical signals is growing as an application in consumer electronics, medical devices and automotive systems to improve safety and efficiency. An area of continued growth for sensors is in the application of MEMS, or microelectromechanical systems which are increasingly included in smartphones, tablets, digital cameras, and numerous other consumer electronic products.

MOS Microprocessors, part of the integrated circuit category, which are predominantly used in PCs and other devices that need processing capabilities also experienced year-over-year growth, with an increase of 7.5 percent in revenue to $65.2B making it the second largest semiconductor market segment for 2011, behind Logic. Strong demand in the enterprise computing segment drove microprocessor sales.

In 2012 the industry is expected to experience further recovery due to increased demand across a broad range of end market segments combined with the delayed sales impact from the supply chain disruptions in the second half of 2011. Additionally, several large semiconductor companies announced plans for new facilities and new R&D projects that will serve to fuel the industry?s long-term growth expectations.

?This year our industry will invest billions in capital expenditures and in R&D, which will pay off both in the short and long term. In fact, reinvesting a large percentage of revenues is a hallmark of the industry. It?s this combination of R&D investment, top engineering talent, high exports and cutting-edge advances that have made the semiconductor industry a cornerstone of the innovation economy,? continued Toohey.

Click here to view the charts and graph for Dec 2011 Global Sales Report.

Semiconductor Industry Association Offers Its Deepest Sympathies at the Passing of Steve Appleton, SIA Board Member and Micron CEO

ckazmierski@sia-online.org (Caroline Kazmierski) — Fri, 03 Feb 2012 00:00:00 -0500

WASHINGTON, D.C.?FEBRUARY 3, 2012?The Semiconductor Industry Association (SIA) is saddened by the tragic news of the death of Steve Appleton, CEO of Micron Technologies and a longstanding member of the Board of SIA. Steve was recognized just this past November with the industry?s highest honor, the Robert N. Noyce Award, in recognition of his immense contributions to the semiconductor industry and our country. SIA extends its deepest sympathies to Steve?s family and the entire Micron community.

Nation?s Top Export Industry Applauds President?s Focus on Innovation, Engineering and Advanced Manufacturing

ckazmierski@sia-online.org (Caroline Kazmierski) — Tue, 24 Jan 2012 07:00:00 -0500

WASHINGTON, D.C.?January 24, 2012?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, applauded President Obama?s commitment to promoting and growing America?s innovation economy, which he outlined in his annual State of the Union address to Congress this evening. The SIA is particularly reassured by the President?s focus and attention to science and engineering education, basic research investments, high-skilled immigration reform, tax reform and fair trade as a balanced approach to addressing the nation?s short and long-term goals.

?Once again, President Obama has chosen to highlight the ?computer chip?- the semiconductor-as a shining example of American-born and bred ingenuity, advanced manufacturing, success of basic research funding and a lynchpin in the President?s goal of doubling exports. Our industry is proud to play a critical part in the economic strength of our nation. But certain policy measures are needed to maintain and grow our critical industry,? said Brian Toohey, president, Semiconductor Industry Association.

The Semiconductor Industry Association encourages Congress and the Administration to work together to provide long-term federal funding commitments for research and education as well as reform of U.S. tax, regulatory, and workforce policies to bolster economic recovery and ensure future American prosperity. Congress and the Administration must act by:

Strategically investing in basic research in the physical sciences and improving Science, Technology, Engineering and Math (STEM) education;

Ensuring that regulations on advanced manufacturing achieve mutual goals;

Permanently extending a strengthened R&D tax credit and reforming corporate tax policies to ensure a competitive environment to attract semiconductor R&D and manufacturing investments to the United States;

Reforming U.S. export controls and streamlining the licensing process;

Ensuring a level playing field for export intensive industries so they are not disadvantaged against foreign competitors; and

Reforming visa policies to retain highly-educated workers for the American workforce.

?The semiconductor industry is driving the innovation economy forward, and represents one of the most essential advanced manufacturing and engineering industries in the United States today; this industry will continue to be a cornerstone in the economic growth and advancement that America hopes to achieve in the future,? continued Toohey. ?We are at a critical intersection in the future of our country and in this industry, which is why funding for basic research, efficient and flexible regulations and high-skilled immigration reform are all essential policies that Congress and the Administration should work together on in order to ensure a thriving innovation economy.?

Further, SIA and its member companies are supportive of an increased focus on trade enforcement related to counterfeits and look forward to working with the Administration on this ever-growing problem. This includes a dual approach of stopping counterfeit semiconductors at the border -- in cooperation with industry -- and supporting intellectual property enforcement actions abroad.

To learn more about the Semiconductor Industry Association visit, www.sia-online.org.

Global Semiconductor Sales Experience Near Term Challenges, Long Term Growth

ckazmierski@sia-online.org (Caroline Kazmierski) — Mon, 02 Jan 2012 07:00:00 -0500

WASHINGTON, D.C.?JANUARY 2, 2012?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced worldwide sales of semiconductors were $25.1 billion for the month of November 2011, a decrease of 2.4 percent from the prior month when sales were $25.7 billion. On a year to date basis, worldwide semiconductor sales are 0.8% higher compared to the same period last year. All monthly sales numbers represent a three-month moving average.

?Supply chain disruptions resulting from the floods in Thailand have impacted semiconductor sales in the near term, however OEM?s are expected to recover production losses over the course of the next few months,? said Brian Toohey, president, Semiconductor Industry Association. ?November sales were additionally affected by the continuing European financial crisis which is having a broad impact on other economies and global demand.?

Despite the near term supply chain and global economic challenges, the industry is still poised to close 2011 with growth and looks towards 2012 for further improvement.

Click here to view the November chart and graph.

Sematech's 3D Enablement Center Focuses on Addressing Challenges Facing Future High Volume 3D Applications

isteff@sia-online.com (Ian Steff) — Tue, 20 Dec 2011 12:00:00 -0500

ALBANY, NY - December 20, 2011 - SEMATECH's 3D Enablement Center (3D EC), together with the Semiconductor Industry Association (SIA) and Semiconductor Research Corporation (SRC), has identified the top technical challenges for new "killer" applications to enable future development of heterogeneous 3D integration beyond mobile wide I/O DRAM.

Following the introduction of the wide I/O DRAM, further research and development of 3D IC technology will be driven by high demand, high volume applications that continue to demonstrate the benefits of 3D integration, including lower power consumption, higher performance, increased functionality, and lower cost.

Since January 2011, SEMATECH's 3D EC has spearheaded the development of standards and specifications for 3D. To prepare for the future 3D integration ICs and systems, the 3D EC is identifying 3- to 5-year window killer applications and the common technical challenges they pose to smoothly extend 3D technology beyond mobile wide I/O DRAM.

Discussions with expert university professors and diverse users, including the 3D EC member companies and SRC, have identified heterogeneous computing, memory, imaging, smart sensor systems, communication switches, and power delivery/conditioning as some of the potential future killer applications. Additionally, the common technical challenges associated with these applications have been prioritized: lowering the cost of 3D architectures, system/architecture pathfinding, generic heterogeneous multi-die stack testing issues, and thermal management.

"Tackling the common challenges of next generation applications is critical for acceleration of the broad adoption of 3D ICs," said Dan Armbrust, president and CEO of SEMATECH. "SEMATECH's 3D Enablement Center's goal in the next phase of this broad based collaborative program is to provide the enabling infrastructure to address these common technical challenges."

"SRC has extensive university programs and expertise, and we are eager to employ these resources and help the industry address such challenges as lowering the cost of 3D structures, thermal management concerns and complex testing issues," said SRC President Larry Sumney. "Combined with SEMATECH's existing efforts in developing 3D technologies, we will pursue an ambitious effort to enable the commercialization of 3D ICs."

"The development of 3D integration technology is at an inflection point," said Brian Toohey, president of the Semiconductor Industry Association (SIA). "The industry has experienced the benefits of collaboration in many efforts, from the semiconductor roadmap to finding the next switch. This evolving partnership aims at taking 3D integration technology to the next step -to fully realize its significant potential for semiconductor manufacturing and design."

SEMATECH's 3D Enablement Center is a cooperative effort among members of the program, the SIA, and the SRC. Since its launch in December 2010, the center has focused on enabling industry-wide ecosystem readiness for cost-effective TSV-based 3D stacked IC solutions. The initial set of activities encompassed working with critical standards development organizations to set 3D standards, especially for inspection/metrology and bump metallurgy. During 2011, the 3D EC expanded its efforts to include activities that would address pathfinding equipment data acquisition (EDA) tools and complex test vehicles.

Membership is open to international fabless, fab-lite, and IDM companies; outsourced semiconductor assembly and test (OSAT) suppliers; and EDA process tool and materials suppliers. In addition, the program and its members are collaborating with a broad network of companies, consortia, universities, national laboratories, and associations from around the world.

About the SIA:
The Semiconductor Industry Association, SIA, is the voice of the U.S. semiconductor industry, America's number-one export industry over the last five years and a bellwether measurement of the U.S. economy. Semiconductor innovations form the foundation for America's $1.1 trillion dollar technology industry affecting a U.S. workforce of nearly 6 million. Founded in 1977 by five microelectronics pioneers, SIA unites over 60 companies that account for 80 percent of the semiconductor production of this country. Through this coalition SIA seeks to strengthen U.S. leadership of semiconductor design and manufacturing by working with Congress, the Administration and other key industry groups. The SIA works to encourage policies and regulations that fuel innovation, propel business and drive international competition in order to maintain a thriving semiconductor industry in the United States. Learn more at www.sia-online.org.

About SRC:

Celebrating 29 years of collaborative research for the semiconductor industry, SRC defines industry needs, invests in and manages the research that gives its members a competitive advantage in the dynamic global marketplace. Awarded the National Medal of Technology, America's highest recognition for contributions to technology, SRC expands the industry knowledge base and attracts premier students to help innovate and transfer semiconductor technology to the commercial industry. For more information, please visit www.src.org.

About SEMATECH:

For over 20 years, SEMATECH� (www.sematech.org), the international consortium of leading semiconductor manufacturers, has set global direction, enabled flexible collaboration, and bridged strategic R&D to manufacturing. Today, we continue accelerating the next technology revolution with our nanoelectronics and emerging technology partners.

Twitter: www.twitter.com/sematechnews

Media Contact: Erica McGill, SEMATECH Media Relations, 518-487-8256, erica.mcgill@sematech.org

Worldwide Semiconductor Sales Projected to Top $300 Billion in 2011

ecaldeira@sia-online.org (Caroline Kazmierski / Ebun Caldeira) — Mon, 05 Dec 2011 08:00:00 -0500

WASHINGTON, D.C.?DECEMBER 5, 2011?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the SIA has endorsed the World Semiconductor Trade Statistics (WSTS) organization?s Autumn 2011 global semiconductor sales forecast which has projected semiconductor sales to grow to $302 Billion for 2011, reaching the $300 Billion mark for the first time and representing a 1.3 percent growth rate over the record-breaking year in 2010. Worldwide sales for October 2011 remained essentially flat at $25.7 billion, a 0.1 percent decrease from prior month?s sales of $25.8 billion. All monthly sales numbers represent a three-month moving average.

?The combination of record-breaking sales in 2010 coupled with this year?s forecast topping the $300 Billion mark for the first time is welcome news for both the semiconductor industry and the entire economy,? said Brian Toohey, president, Semiconductor Industry Association. ?Despite a challenging global economic environment this year and the natural disasters that have impacted production in Asia, the semiconductor industry has demonstrated impressive resilience. The growing level of semiconductor content embedded across a wide range of consumer, industrial, business and government applications points to continued growth in 2012 and 2013.?

For the month of October 2011, Japan continued its recovery with month-over-month growth at 2.2 percent marking the fourth consecutive month of growth. Additionally, year to date semiconductor shipments to the Americas region grew 4.6 percent, followed by shipments to Asia Pacific at 3.4 percent and Europe at 1.2 percent year-over-year.

Beyond 2011, the industry is on track to grow steadily and modestly according to the WSTS forecast. WSTS is predicting 3.7 percent growth for 2012 and 5.8 percent growth for 2013. WSTS tabulates its annual forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

OCTOBER 2011 GSR GRAPH & CHART

WSTS AUTUMN 2011 FORECAST SUMMARY TABLE

Increased Funding for Scientific Research Marks Investment in American Innovation

ckazmierski@sia-online.org (Caroline Kazmierski) — Fri, 18 Nov 2011 07:00:00 -0500

WASHINGTON, D.C.?NOVEMBER 18, 2011?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today applauded passage of the Fiscal Year (FY) 2012 Commerce, Justice and Science Appropriations bill because of the strong funding commitment to maintain essential research at both the National Institute of Standards and Technology (NIST) and the National Science Foundation (NSF).

?Government funding for scientific research represents a deep commitment to the future of our country and we applaud leaders in both the House and Senate for their foresight and fortitude to prioritize budgets at both NIST and NSF,? said Brian Toohey, president, Semiconductor Industry Association. ?Research funding is the engine that will fuel the economy for years to come. We simply cannot go without this critical down payment to secure America?s technology leadership in the 21^st century.?

The final FY 2012 Commerce, Justice and Science Appropriations Bill commits $7 billion for NSF, representing an increase of $155 million over FY 2011 funding, and $751 million for NIST, an increase of $33 million. President Obama is expected to sign the bill later today.

The semiconductor industry ? through its research consortia the Semiconductor Research Corporation (SRC) ? has funded over $869 million in university research directly from company contributions. The SRC partners with NIST and NSF to fund critical university research. Both agencies jointly fund the Nanoelectronics Research Initiative (NRI) with industry ? a critical public-private partnership that is conducting groundbreaking scientific research at over thirty universities to develop novel computing devices that will ultimately replace current transistor technology.

?The semiconductor industry has had a long-standing and fruitful partnership with government, which has produced the fundamental building blocks for advancing semiconductor manufacturing and innovative breakthroughs ultimately leading to commercialization. Government funding for successful partnerships is critical to maintaining the rapid pace of innovation that the market has come to demand,? continued Toohey.

NIST research in metrology helps reach accuracy levels outlined in the International Technology Roadmap for Semiconductors (ITRS). The ability to accurately measure widths on a nanoscale must be realized to manufacture ever smaller circuits on tomorrow?s semiconductor chips ? a field in which the U.S. leads today.

NSF is the funding source for approximately 20 percent of all federally supported basic research conducted by America's colleges and universities. NSF continues to play an important role in implementing one of the National Nanotechnology Initiative (NNI)?s signature initiatives: ?Nanoelectronics for 2020 and Beyond?.

In addition to the NSF research mission, SIA also applauds continued support for the Noyce Teacher Scholarship Program at NSF ? a program that recruits and trains individuals to become K-12 math and science teachers. ?Effective science, technology, engineering, and math (STEM) education initiatives ? like NSF?s Noyce Program -- will ensure that our industry has a skilled workforce capable of competing and innovating,? said Toohey. The Noyce Grant is named after Robert N. Noyce who was the co-founder of Fairchild Semiconductor and Intel Corporation and co-inventor of the integrated circuit.

SIA President Testifies At Senate Armed Services Committee on Dangers of Counterfeit Chips

ckazmierski@sia-online.org (Caroline Kazmierski) — Tue, 08 Nov 2011 07:00:00 -0500

WASHINGTON, D.C.?NOVEMBER 8, 2011?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that SIA President, Brian Toohey testified on behalf of the industry before the Senate Armed Services Committee to aide in their investigation into counterfeit electronic parts in the Department of Defense (DOD) supply chain.

Counterfeit electronics, and the semiconductors they are built on, are a growing threat to the health and safety of military and civilians alike. This is especially true as microelectronics are found in an increasing number of mission-critical applications such as lifesaving medical devices, automotive safety systems, airplanes and the tools, systems, and communications equipment that the United States military relies on today.

?The catastrophic failure risk inherently found in counterfeit semiconductors places our citizens and military personnel in unreasonable peril. A counterfeit semiconductor is a ticking time bomb,? said Brian Toohey, president, Semiconductor Industry Association. ?What is more, counterfeiters violate American companies? intellectual property rights and cost American?s jobs. We estimate that counterfeiting costs U.S.-based semiconductor companies more than $7.5 billion each year.?

The presence of counterfeit electronics in the DOD supply chain is a multi-faceted problem which requires a multi-pronged approach with a coordinated effort from both industry and government. There are five actions that the SIA has recommended to the Committee to effectively stem the tide of counterfeit electronics:

Support and continue partnerships between industry and the DOD and Department of Justice (DOJ) to develop a more robust and effective authentication system;
Strengthen procurement procedures at DOD for mission-critical components, including purchasing exclusively from authorized distributors;
Ensure industry?s ability to fully partner with Customs and Border Patrol Officials to stop suspected counterfeits at the border by ending CBP's redaction policy;
Aggressively prosecute counterfeit traffickers; and finally
Stronger enforcement of intellectual property rights internationally.

?Our industry takes this threat very seriously and we are committed to doing everything within our power to work with the DOD and other government agencies to stop counterfeits from entering the U.S. and our military and civilian supply chains,? continued Toohey.

To learn more about SIA?s efforts to stop counterfeit semiconductors and to read Mr. Toohey?s full written testimony visit, http://www.sia-online.org/index.php?submenu=TradeDocs&src=directory&view=DocumentSIA&srctype=trade

Freescale CEO Takes Helm as Semiconductor Industry Association Chairman

ckazmierski@sia-online.org (Caroline Kazmierski) — Thu, 03 Nov 2011 07:00:00 -0400

SAN JOSE, CA?NOVEMBER 3, 2011?The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing and design, today announced that the SIA Board of Directors has elected Freescale Semiconductor CEO, Rich Beyer as its 2012 chairman.

?As the association embarks on its 35^th year of representing the semiconductor industry?s interests both in Washington, DC and around the world, we are pleased to have an industry veteran like Rich Beyer champion our efforts,? said Brian Toohey, president, Semiconductor Industry Association. ?Rich?s background in systems and semiconductors and his wide variety of leadership roles throughout the industry will help to advance SIA?s public policy goal to strengthen and maintain a thriving semiconductor industry in America.?

Rich Beyer joined Freescale Semiconductor in March 2008. Prior to Freescale, he held leadership positions at Intersil Corporation, Elantec Semiconductor, VLSI Technology and National Semiconductor Corporation. Mr. Beyer earned his bachelors and master?s degrees from Georgetown University and an MBA from Columbia University Graduate School of Business. He also served three years as an officer in the United States Marine Corps and currently serves as a member of the Partnership for a New American Economy and on the U.S. Department of Commerce?s Manufacturing Council.

?It is my distinct pleasure to serve as the 2012 SIA Chairman, especially as the Association celebrates its 35^th anniversary,? said Rich Beyer, Chairman of the Board and Chief Executive Officer, Freescale Semiconductor. ?It is critical that we create an environment in America that fosters semiconductor innovation and the entrepreneurial spirit, particularly since our industry will be at the heart of some of the solutions to the challenges we face as a nation and a global community. As the chairman of the SIA, that message will be central to our advocacy efforts in Washington, DC and around the world.?